Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2005-11-08
2005-11-08
Zarneke, David A. (Department: 2891)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
Reexamination Certificate
active
06962882
ABSTRACT:
While a crucible containing an Si material and a substrate to be processed are set in a chamber, Ar gas is supplied into the chamber and the Si material is evaporated by heating, thereby forming a nanoparticle thin film of Si on the substrate. This substrate is then annealed in an oxygen atmosphere to oxidize Si, forming a nanoparticle oxide thin film consisting of SiO2.
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Nozaki. S., et al., “Ultralow K Nanoporous Silica by Oxidation of Silicon Nanoparticles.” The University of Electro-Communications, Department of Electronic Engineering, Tokyo, Japan, presented Jun. 3, 2002, at the 2002 IEEE International Interconnect Technology Conference in Burlingame, CA.
Morisaki Hiroshi
Nozaki Shinji
Uchida Kazuo
Christensen O'Connor Johnson & Kindness PLLC
Kilday Lisa
Semiconductor Technology Academic Research Center
Zarneke David A.
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