Plastic lead frames for semiconductor devices

Details Plastic lead frames for semiconductor devices Plastic lead frames for semiconductor devices

2005-12-27

2005-12-27

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S690000, C257S741000, C361S813000

Reexamination Certificate

active

06979889

ABSTRACT:
A conductive plastic lead frame and method of manufacturing the same, suitable for use in IC packaging, circuit card, electronic device, and a computer system. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment, the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.

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