Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2005-11-15
2005-11-15
Clark, S. V. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257S782000, C438S118000
Reexamination Certificate
active
06965171
ABSTRACT:
An integrated circuit (IC) chip module includes at least one integrated circuit chip mounted upon a substrate, and a plurality of passive components mounted upon the substrate. A polymer based bib has at least one opening formed therein, the at least one opening configured to accommodate the at least one integrated circuit chip therein, and the bib further configured for attachment to one or more of the plurality of passive components. A protective cap is mounted over the at least one integrated circuit chip and attached to the substrate, wherein the bib is configured to retain thereon a thermally conductive paste initially applied to at least one of the integrated circuit chip and the protective cap.
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Lee Tim H.
Lei Chon C.
Papae Donald J.
Szenher Francis F.
Cantor & Colburn LLP
Cioffi James J.
Clark S. V.
International Business Machines - Corporation
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