Electronic device configured as a multichip module,...

Details Electronic device configured as a multichip module,... Electronic device configured as a multichip module,...

2005-06-07

2005-06-07

Cao, Phat X. (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S123000, C438S124000

Reexamination Certificate

active

06902951

ABSTRACT:
An electronic device has, as a multichip module, two or more semiconductor chips that are integrated into a leadframe such that a placement side of the leadframe and the active top sides of the circuit chips are flush and have a common fine wiring plane. The leadframe is arranged as an expanded semiconductor chip on a rewiring substrate.

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