Semiconductor device exhibiting a high breakdown voltage and...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S492000, C257S493000

Reexamination Certificate

active

06853034

ABSTRACT:
The invention provides a semiconductor device exhibiting a stable and high breakdown voltage, which is manufactured at a low manufacturing cost. The semiconductor device of the invention includes an n-type silicon substrate; a p-type base region in the surface portion of substrate; an n-type drain region in the surface portion of n-type substrate; a p-type offset region in the surface portion of n-type substrate; an n-type source region in the surface portion of p-type base region; a p-type contact region in the surface portion of p-type base region; a gate electrode above the extended portion of p-type base region extending between n-type source region and n-type substrate (or p-type offset region), with a gate insulation film interposed therebetween; an insulation film on gate electrode and p-type offset region; a source electrode on n-type source region; and a drain electrode on n-type drain region. The p-type offset region is formed of a first p-type sub-region, a second p-type sub-region, and a third p-type sub-region.

REFERENCES:
patent: 5432370 (1995-07-01), Kitamura et al.
patent: 5705842 (1998-01-01), Kitamura et al.
patent: 6069396 (2000-05-01), Funaki
patent: 6614089 (2003-09-01), Nakamura et al.
patent: 6-120510 (1994-04-01), None
“Lowered on-state resistance of lateral power MOSFET with high withstand voltage for Intelligent Power Device”; Uno et al.; The Institute of Electrical Engineers of Japan, EDD-93-21, SPC-93-43; pp. 21-29; Oct. 7, 1993.

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