Wafer processing apparatus and wafer processing method using...

Details Wafer processing apparatus and wafer processing method using... Wafer processing apparatus and wafer processing method using...

2005-02-01

2005-02-01

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S730000, C438S974000

Reexamination Certificate

active

06849555

ABSTRACT:
An integrated in situ cluster type wafer processing apparatus which can be used for forming metal wiring layers having a multi-layered structure and a wafer processing method using the same are provided. The wafer processing apparatus includes a transfer chamber which can be exhausted and has a plurality of gate valves, a plurality of vacuum processing chambers each of which can be connected to the transfer chamber via one of the gate valves, and a load lock chamber which can be exhausted and is connectable to a first gas feed line for feeding an oxygen-based gas into the load lock chamber. In a wafer processing method, a predetermined layer is formed on a wafer in one of the vacuum processing chambers. The predetermined layer on the wafer is oxidized in the load lock chamber or an oxygen atmosphere chamber.

REFERENCES:
patent: 4951601 (1990-08-01), Maydan et al.
patent: 5759360 (1998-06-01), Ngan et al.
patent: 5976328 (1999-11-01), Azuma et al.
patent: 5981399 (1999-11-01), Kawamura et al.
patent: 6001738 (1999-12-01), Lin et al.
patent: 6391769 (2002-05-01), Lee et al.
patent: 09-153484 (1997-06-01), None
patent: 1994-0027870 (1996-05-01), None
patent: 2000-0010182 (2000-02-01), None

Affiliated with

Also associated with

Rating

Wafer processing apparatus and wafer processing method using... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer processing apparatus and wafer processing method using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer processing apparatus and wafer processing method using... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3507899