Method of self-annealing conductive lines that separates...

Details Method of self-annealing conductive lines that separates... Method of self-annealing conductive lines that separates...

2005-12-27

2005-12-27

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S674000, C438S675000, C438S685000, C438S687000

Reexamination Certificate

active

06979642

ABSTRACT:
A method of forming a conductive structure such as a copper conductive structure, line, or via is optimized for large grain growth and distribution of alloy elements. The alloy elements can reduce electromigration problems associated with the conductive structure. The conductive structure is self-annealed or first annealed in a low temperature process over a longer period of time. Another anneal is utilized to distribute alloy elements.

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