Semiconductor device having storage node contact plug of...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S906000, C257S907000, C257S908000, C257S304000, C257S305000, C438S241000, C438S253000, C438S254000, C438S255000

Reexamination Certificate

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06849889

ABSTRACT:
A method for forming a storage node contact plug of a dynamic random access memory includes forming insulating layers on an overall surface of a semiconductor substrate having a plurality of buried contact plugs, etching the insulating layers down to a top surface of the buried contact plugs to form first contact holes on the buried contact plugs, forming a photoresist pattern on the insulating layers and the first contact holes, etching the insulating layers to form second contact holes on the second insulating layer, and filling the first and second contact holes with conductive material.

REFERENCES:
patent: 5629539 (1997-05-01), Aoki et al.
patent: 5687111 (1997-11-01), Wada et al.
patent: 5702982 (1997-12-01), Lee et al.
patent: 5780331 (1998-07-01), Liaw et al.
patent: 5926732 (1999-07-01), Matsuura
patent: 6150690 (2000-11-01), Ishibashi et al.
patent: 6277720 (2001-08-01), Doshi et al.
patent: 10-200067 (1998-07-01), None

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