Method of manufacturing electronic circuit component

Details Method of manufacturing electronic circuit component Method of manufacturing electronic circuit component

2005-12-27

2005-12-27

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S620000

Reexamination Certificate

active

06979644

ABSTRACT:
A method of manufacturing an electronic circuit component, including the steps of: (a) forming a first thin film circuit element on a surface of a circuit board made of an Si substrate; (b) forming a hole or trench from the surface of the circuit board through at least a portion of a thickness of the Si substrate by etching; (c) forming an insulating film covering a surface of the formed hole or trench; (d) adhering a dry film of photoresist to the surface of the circuit board, the dry film capping an opening of the hole or trench; (e) patterning the dry film; and (f) by using the patterned dry film as a mask, etching the insulating film. An electronic circuit component having through conductors and being less influenced by high temperature annealing can be manufactured.

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