Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-06-28
2005-06-28
Nguyen, Thanh (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S123000, C438S612000, C438S613000, C438S614000, C438S617000
Reexamination Certificate
active
06911355
ABSTRACT:
A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in electrical communication with the external contacts. The package also includes interconnects configured to provide separate electrical paths between die contacts (e.g., bond pads), and the conductors on the flex circuit. Several different embodiments of interconnects are provided including: bumps on the die contacts, bonded to the flex circuit conductors with a conductive adhesive layer; polymer bumps on the conductors, or die contacts, applied in a semi-cured state and then fully cured; solder bumps on the die contacts and conductors, bonded to one another using a bonding tool; rivet-like bonded connections between the conductors and die contacts, formed using metal bumps and a wire bonding or ball bonding apparatus; single point bonded connections between the conductors and die contacts, formed with a bonding tool; and wire bonds between the conductors and die contacts.
REFERENCES:
patent: 5072283 (1991-12-01), Bolger
patent: 5155302 (1992-10-01), Nguyen
patent: 5206585 (1993-04-01), Chang et al.
patent: 5434357 (1995-07-01), Belcher et al.
patent: 5440240 (1995-08-01), Wood et al.
patent: 5477160 (1995-12-01), Love
patent: 5593927 (1997-01-01), Farnworth et al.
patent: 5674785 (1997-10-01), Akram et al.
patent: 5678301 (1997-10-01), Gochnour et al.
patent: 5683942 (1997-11-01), Kata et al.
patent: 5739585 (1998-04-01), Akram et al.
patent: 5770889 (1998-06-01), Rostoker
patent: 5773322 (1998-06-01), Weld
patent: 5783865 (1998-07-01), Higashiguchi et al.
patent: 5789278 (1998-08-01), Akram et al.
patent: 5847929 (1998-12-01), Bernier et al.
patent: 5879761 (1999-03-01), Kulesza et al.
patent: 5889232 (1999-03-01), Tanaka et al.
patent: 5889326 (1999-03-01), Tanaka
patent: 5892271 (1999-04-01), Takeda et al.
patent: 5910641 (1999-06-01), Gaynes et al.
patent: 5915755 (1999-06-01), Gochnour et al.
patent: 6001724 (1999-12-01), Stansbury
patent: 6002180 (1999-12-01), Akram et al.
patent: 6013948 (2000-01-01), Akram et al.
patent: 6020220 (2000-02-01), Gilleo et al.
patent: 6097087 (2000-08-01), Farnworth et al.
patent: 6107122 (2000-08-01), Wood et al.
patent: 6194780 (2001-02-01), Tang
patent: 6368896 (2002-04-01), Farnworth et al.
patent: 6465877 (2002-10-01), Farnworth et al.
patent: 6740960 (2004-05-01), Farnworth et al.
Aschenbrenner et al., “Adhesive Flip Chip Bonding on Flexible Substrates”, Oct. 26-30, 1997, Polymeric Electronics Packaging, The First IEEE International Symposium, pp. 86-94.
Kallmayer et al., “A Low Cost Approach to CSP Based on Meniscus Bumping, Laser Bonding Through Flex and Laser Solder Ball Placement”, Oct. 8-10, 1997, Electronic Packaging Technology Conference, 1997, Proceedings of the 1997 lst, pp. 34-40.
Kloeser et al., “Approaches to Flip Chip Technology using Electroless Nickel-Gold Bumps”, Dec. 4-6, 1995, Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International, pp. 60-66.
“Solder Bump Formation on VIA Holes”, IBM Technical Disclosure Bulletin, vol. 37, No. 06B, Jun. 1994, p. 299.
High Density, Low Temperature Solder Reflow Bonding of Silicon Chips to Plastic Substrates, IBM Technical Disclosure Bulletin, vol. 18, No. 20, Mar. 1976, p. 3477.
Gratton Stephen A.
Nguyen Thanh
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