Semiconductor device having a gate structure surrounding a fin

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S316000, C257S406000

Reexamination Certificate

active

06960804

ABSTRACT:
A double-semiconductor device includes a substrate, an insulating layer, a fin and a gate. The insulating layer is formed on the substrate and the fin is formed on the insulating layer. The fin has a number of side surfaces, a top surface and a bottom surface. The gate is formed on the insulating layer and surrounds the top surface, bottom surface and the side surfaces of the fin in the channel region of the semiconductor device. Surrounding the fin with gate material results in an increased total channel width and more flexible device adjustment margins.

REFERENCES:
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Digh Hisamoto et al., “FinFET-A Self-Aligned Double-Gate MOSFET Scalable to 200 nm,” IEEE Transactions on Electron Devices, vol. 47, No. 12, Dec. 2000, pp. 2320-2325.
Yang-Kyu Choi et al., “Sub-20nm CMOS FinFET Technologies,” 2001 IEEE, IEDM, pp. 421-424.
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