Process for polishing a semiconductor substrate

Details Process for polishing a semiconductor substrate Process for polishing a semiconductor substrate

1994-07-25

1996-06-11

Fourson, George

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566451, 437228, H01L 21306

Patent

active

055251919

ABSTRACT:
The selection of pH, the polishing slurry, and types of polishing particles within a polishing slurry are chosen, so that polishing product is capable of coating onto the polishing particles. More specifically, the pH of the polishing slurry is selected to be between the iso-electric points of the polishing product and the particles within the polishing slurry. More than one type of material may be used within a polishing slurry. Particles of one material may do most of the polishing, while the particles of the other material become coated with polishing product and aid in transporting it away from the substrate.

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Cook; "Chemical Processes In Glass Polishing;" Journ. of Non-Crystalline Solids 120; pp. 152-171 (1990).

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