Method for forming an interconnection in a semiconductor...

Details Method for forming an interconnection in a semiconductor... Method for forming an interconnection in a semiconductor...

2005-06-07

2005-06-07

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S687000

Reexamination Certificate

active

06903008

ABSTRACT:
There is disclosed a method for forming an interconnection in the semiconductor element, including a process for forming a groove117on an underlying substrate so as to correspond to the designed pattern, a process for forming an underlayer to improve crystalline of an interconnection which will be formed in the succeeding stage on said underlying substrate with said groove, a process for forming a thin film of the interconnection material, a heat-treatment process to fill the said groove with the thin film of the interconnection material formed on the underlying substrate, and a process for forming the interconnection by polishing the surface of the thin film by predetermined quantity.

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