Resin encapsulation molding method of electronic part and...

Details Resin encapsulation molding method of electronic part and... Resin encapsulation molding method of electronic part and...

2005-12-20

2005-12-20

Blum, David S. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Reexamination Certificate

active

06977188

ABSTRACT:
First, an intermediate plate and a lower mold are clamped. Thus, a release film is sandwiched between a mold surface of the intermediate plate and a mold surface of the lower mold. In this state, the clamping of an upper mold and the intermediate plate begins. Thus, an enclosed space is formed. Thereafter, the enclosed space is forcibly evacuated. At this time, the upper mold and the intermediate plate is gradually clamped. As a result, the enclosed space is filled with a molten resin and the resin encapsulation mold is completed. According to this method, the release film is prevented from moving into the enclosed space. Thus, deformation or severing of a wire is avoided when the resin encapsulation molding is performed.

REFERENCES:
patent: 6471501 (2002-10-01), Shinma et al.
patent: 1189270 (2002-03-01), None
patent: 11274192 (1999-10-01), None
patent: 400586 (2000-08-01), None

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