Thin-film electronic device module

Details Thin-film electronic device module Thin-film electronic device module

2005-08-30

2005-08-30

McPherson, John A. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C257S787000, C257S088000, C257S433000, C257S100000, C345S055000, C345S082000, C349S149000

Reexamination Certificate

active

06936407

ABSTRACT:
In an embodiment of this invention, an encapsulated electronic thin-film device includes a substrate and an active area is fabricated on the substrate. The active area is comprised of at least one electronic thin-film element. A thin-film encapsulation layer is selectively deposited on at least the active area to cover at least the active area. Traces protrude slightly past a perimeter of the thin-film encapsulation layer. The traces are routed to two or more contact pads to which one or more connectors can attach. Attaching the connector to the contact pads allows an external device to be coupled to the active area of the electronic thin-film device.

REFERENCES:
patent: 5693956 (1997-12-01), Shi et al.
patent: 5703394 (1997-12-01), Wei et al.
patent: 5747363 (1998-05-01), Wei et al.
patent: 5831699 (1998-11-01), Wright et al.
patent: WO 01/082390 (2001-11-01), None

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