Methods of forming via plugs using an aerosol stream of...

Details Methods of forming via plugs using an aerosol stream of... Methods of forming via plugs using an aerosol stream of...

2005-02-15

2005-02-15

Smoot, Stephen W. (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S675000, C438S686000

Reexamination Certificate

active

06855631

ABSTRACT:
An aerosol stream of particles of a conductive material is directed into a via of an integrated circuit device to deposit the conductive material within the via to form a via plug.

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B. King, M. Renn and M Essien, M3D Technology, Maskless Mesoscale™ Materials Deposition, “M3D Technology deposits electronic materials onto low-temperature, non-planar substrates without masks or resists,” Optomec, Inc.
M3D, Maskless Mesoscale™ Materials Deposition, Optomec, Inc.

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