Pattern forming method and apparatus, and device fabrication...

Details Pattern forming method and apparatus, and device fabrication... Pattern forming method and apparatus, and device fabrication...

2005-12-20

2005-12-20

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S677000, C438S584000, C438S745000, C427S466000, C427S534000

Reexamination Certificate

active

06977222

ABSTRACT:
The invention saves resources and energy. A cleaning/fluid-feeding head integrates a cleaning head portion and a fluid-feeding head portion. The cleaning head portion includes an organic substance cleaning unit, an inorganic substance cleaning unit, a rinsing unit and a drying unit. The organic substance cleaning unit, inorganic substance cleaning unit and rinsing unit selectively clean pattern forming regions on a substrate by feeding thereto a first cleaning fluid, second cleaning fluid and pure water, respectively. The drying unit dries the rinsed pattern forming regions by blowing hot air thereonto. The fluid-feeding head portion selectively feeds a liquid pattern forming material to the cleaned pattern forming regions.

REFERENCES:
patent: 6365531 (2002-04-01), Hayashi et al.
patent: 6599582 (2003-07-01), Kiguchi et al.
patent: 2002/0067400 (2002-06-01), Kawase et al.
patent: 11-204529 (1999-07-01), None
patent: 2000-349059 (2000-12-01), None
patent: 2001-151345 (2001-05-01), None
patent: 2002-221616 (2002-08-01), None

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