Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2005-12-13
2005-12-13
Paumen, Gary (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S076100, C439S945000, C439S629000
Reexamination Certificate
active
06974334
ABSTRACT:
A package for being electrically connected to an external printed wiring board and an external electronic device comprises a substrate, a semiconductor chip, a mold compound, and a connector. The substrate is electrically connected to the external printed wiring board. The semiconductor chip is disposed on and electrically connected to the substrate. The molding compound is used for encapsulating the semiconductor chip. The connector is disposed on the substrate for electrically connecting the semiconductor chip to the external electronic device.
REFERENCES:
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patent: 5808873 (1998-09-01), Celaya et al.
patent: 6294731 (2001-09-01), Lu et al.
patent: 6307749 (2001-10-01), Daanen et al.
patent: 6469909 (2002-10-01), Simmons
patent: 6573609 (2003-06-01), Fjelstad et al.
patent: 6633490 (2003-10-01), Centola et al.
Advanced Semiconductor Engineering Inc.
Leon Edwin A.
Paumen Gary
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