Method of forming a leadframe for a semiconductor package

Details Method of forming a leadframe for a semiconductor package Method of forming a leadframe for a semiconductor package

2005-02-08

2005-02-08

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S456000

Reexamination Certificate

active

06852574

ABSTRACT:
A method of forming a leadframe (10) provides blocking fulcrums (21,23) adjacent to the leads (12,13,14, and15). During the process of encapsulating the leadframe (10), the blocking fulcrums (21,23) restrict encapsulating material from exiting the mold cavity and from attaching to the leads (12,13,14, and15).

REFERENCES:
patent: 5059379 (1991-10-01), Tsutsumi et al.
patent: 6116963 (2000-09-01), Shutter
patent: 6518652 (2003-02-01), Takata et al.
patent: 6769936 (2004-08-01), Gutierrez et al.

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