4. Equipment for production, distribution, or transformation of ene
  5. Distribution, modification or control
  6. Semiconductor, transistor or integrated circuit

Darrell D. Truhitte

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Method of forming a leadframe for a semiconductor package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Semiconductor device package

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Semiconductor – transistor or integrated circuit
Design Patent

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Semiconductor device package

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Semiconductor – transistor or integrated circuit
Design Patent

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Profile ID: LFUS-PAI-P-2850680

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