Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-12-27
2005-12-27
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C257S706000, C257S712000, C165S080300, C165S185000
Reexamination Certificate
active
06980438
ABSTRACT:
A semiconductor package with a heat dissipating structure includes a substrate, a chip and a heat dissipating structure. The chip is mounted on and electrically connected to the substrate. The heat dissipating structure includes a first heat sink having at least one positioning portion, and at least one second heat sink having at least one second positioning portion and at least one hollow portion. The second heat sink is mounted on the substrate, and the first positioning portion of the first heat sink is attached to the second positioning portion of the second heat sink, allowing the chip to be accommodated in a space defined by the first heat sink, the hollow portion of the second heat sink and the substrate. This semiconductor package has good heat dissipating efficiency and is cost-effective to fabricate.
REFERENCES:
patent: 5227663 (1993-07-01), Patil et al.
patent: 5311402 (1994-05-01), Kobayashi et al.
patent: 5600541 (1997-02-01), Bone et al.
patent: 5637920 (1997-06-01), Loo
patent: 5773886 (1998-06-01), Rostoker et al.
patent: 5909057 (1999-06-01), McCormick et al.
patent: 5909474 (1999-06-01), Yoshizawa
patent: 5956226 (1999-09-01), Jung et al.
patent: 6462410 (2002-10-01), Novotny et al.
patent: 6552266 (2003-04-01), Carden et al.
patent: 2004/0264136 (2004-12-01), Houle
Chen Chin-Te
Huang Chien-Ping
Lin Chang-Fu
Pu Han-Ping
Chervinsky Boris
Corless Peter F.
Edwards Angell Palmer & & Dodge LLP
Jensen Steven M.
Siliconware Precision Industries Co. Ltd.
LandOfFree
Semiconductor package with heat dissipating structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package with heat dissipating structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package with heat dissipating structure will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3479684