Fishing – trapping – and vermin destroying
Patent
1989-08-15
1992-02-04
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437225, 148DIG46, 156643, 2504922, 2504923, 2191212, 21912126, H01L 2126
Patent
active
050860151
ABSTRACT:
A method of etching a semiconductor device having multi-layered wiring by an ion beam is disclosed which method comprises the steps of: extracting a high-intensity ion beam from a high-density ion source; focusing the extracted ion beam; causing the focused ion beam to perform a scanning operation by a voltage applied to a deflection electrode; forming a first hole in the semiconductor device by the focused ion beam to a depth capable of reaching an insulating film formed between upper and lower wiring conductors so that the first hole has a curved bottom corresponding to the undulation of the upper wiring conductor, and the upper wiring conductor is absent at the bottom of the first hole; and scanning a portion of the bottom of the first hole with the focused ion beam to form a second hole in the insulating film to a depth capable of reaching the lower wiring conductor, thereby preventing the shorting between the upper and lower wiring conductors. Further, a method of forming a hole of a predetermined shape at a surface area having a step-like portion of a semiconductor device by an ion beam is disclosed which method comprises a pre-etching step of scanning the high-level region of the step-like portion with the ion beam so that the high-level region becomes equal in level to the low-level region of the step-like portion, and a main step of scanning the whole of the surface area with the ion beam till the hole of the predetermined shape is formed in the semiconductor device.
REFERENCES:
patent: 4639301 (1987-01-01), Doherty et al.
patent: 4698129 (1987-10-01), Puretz et al.
patent: 4868068 (1989-09-01), Yamaguchi et al.
patent: 4874460 (1989-10-01), Nakagawa et al.
patent: 4874947 (1989-10-01), Ward et al.
patent: 4900695 (1990-02-01), Takahashi
Haraichi Satoshi
Hongo Mikio
Itoh Fumikazu
Shimase Akira
Takahashi Takahiko
Hearn Brian E.
Hitachi , Ltd.
Holtzman Laura M.
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