Die paddle clamping method for wire bond enhancement

Details Die paddle clamping method for wire bond enhancement Die paddle clamping method for wire bond enhancement

2005-12-20

2005-12-20

Schillinger, Laura M (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S111000, C438S123000, C257S666000, C257S784000

Reexamination Certificate

active

06977214

ABSTRACT:
A leadframe configuration for a semiconductor device that has a die attach paddle with paddle support bars. In addition, clamp tabs extend outwardly from lesser supported locations of the paddle to underlie a conventional lead clamp. The clamp tabs are formed as an integral part of the paddle. Normal clamping during die attach and wire bonding operations prevents paddle movement and enhances integrity of the die bond and wire bonds.

REFERENCES:
patent: 3566207 (1971-02-01), Adams
patent: 3657805 (1972-04-01), Johnson
patent: 3685137 (1972-08-01), Gardiner
patent: 3708730 (1973-01-01), Schierz et al.
patent: 3995845 (1976-12-01), Scheffer
patent: 4030657 (1977-06-01), Scheffer
patent: 4214120 (1980-07-01), Jones, Jr. et al.
patent: 4258381 (1981-03-01), Inaba
patent: 4361261 (1982-11-01), Elles et al.
patent: 4434347 (1984-02-01), Kurtz et al.
patent: 4527730 (1985-07-01), Shirai et al.
patent: 4600138 (1986-07-01), Hill
patent: 4603803 (1986-08-01), Chan et al.
patent: 4653681 (1987-03-01), Dreibelbis et al.
patent: 4721994 (1988-01-01), Mine et al.
patent: 4765531 (1988-08-01), Ricketson et al.
patent: 4766478 (1988-08-01), Dennis
patent: 4778097 (1988-10-01), Hauser
patent: 4821945 (1989-04-01), Chase et al.
patent: 4978393 (1990-12-01), Maheas
patent: 4978835 (1990-12-01), Luijtjes et al.
patent: 5035034 (1991-07-01), Cotney
patent: 5062565 (1991-11-01), Wood et al.
patent: 5082165 (1992-01-01), Ishizuka
patent: 5114066 (1992-05-01), Amador et al.
patent: 5148959 (1992-09-01), Cain et al.
patent: 5193733 (1993-03-01), You
patent: 5197652 (1993-03-01), Yamazaki
patent: 5217154 (1993-06-01), Elwood et al.
patent: 5238174 (1993-08-01), Ricketson et al.
patent: 5264002 (1993-11-01), Egashira et al.
patent: 5294827 (1994-03-01), McShane
patent: 5307929 (1994-05-01), Seidler
patent: 5307978 (1994-05-01), Ricketson et al.
patent: 5322207 (1994-06-01), Fogal et al.
patent: 5334872 (1994-08-01), Ueda et al.
patent: 5358905 (1994-10-01), Chiu
patent: 5367253 (1994-11-01), Wood et al.
patent: 5372972 (1994-12-01), Hayashi et al.
patent: 5378656 (1995-01-01), Kajihara et al.
patent: 5384155 (1995-01-01), Abbott et al.
patent: 5420758 (1995-05-01), Liang
patent: 5421503 (1995-06-01), Perlberg et al.
patent: 5425491 (1995-06-01), Tanaka et al.
patent: 5445306 (1995-08-01), Huddleston
patent: 5455200 (1995-10-01), Bigler et al.
patent: 5465899 (1995-11-01), Quick et al.
patent: 5527740 (1996-06-01), Golwalkar et al.
patent: 5532905 (1996-07-01), Moore
patent: 5559364 (1996-09-01), Hojyo
patent: 5633529 (1997-05-01), Otsuki
patent: 5647528 (1997-07-01), Ball et al.
patent: 5904288 (1999-05-01), Humphrey
patent: 6000599 (1999-12-01), Ball et al.
patent: 6047877 (2000-04-01), Ball
patent: 6068174 (2000-05-01), Ball et al.
patent: 6068180 (2000-05-01), Test
patent: 6072230 (2000-06-01), Carter et al.
patent: 6121673 (2000-09-01), Kinsman
patent: 6121674 (2000-09-01), Corisis
patent: 6133623 (2000-10-01), Otsuki et al.
patent: 6281566 (2001-08-01), Magni
patent: 6299049 (2001-10-01), Ball et al.
patent: 6478211 (2002-11-01), Ball et al.
patent: 6588649 (2003-07-01), Evers et al.
patent: 01231334 (1989-09-01), None
H.K. Charles, Jr.; “Electrical Interconnection”; pps. 224-236.

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