Chemical mechanical polishing with multiple polishing pads

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

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Details

C451S057000

Reexamination Certificate

active

06848976

ABSTRACT:
In chemical mechanical polishing, a substrate is planarized with one or more fixed-abrasive polishing pads. Then the substrate is polished with a standard polishing pad to remove scratch defects created by the fixed-abrasive polishing pads.

REFERENCES:
patent: 3841031 (1974-10-01), Walsh
patent: 5152917 (1992-10-01), Pieper et al.
patent: 5244534 (1993-09-01), Yu et al.
patent: 5342419 (1994-08-01), Hibbard
patent: 5378251 (1995-01-01), Culler et al.
patent: 5395801 (1995-03-01), Doan et al.
patent: 5514245 (1996-05-01), Doan et al.
patent: 5676587 (1997-10-01), Landers et al.
patent: 5718618 (1998-02-01), Guckel et al.
patent: 5738574 (1998-04-01), Tolles et al.
patent: 5752875 (1998-05-01), Ronay
patent: 5823855 (1998-10-01), Robinson
patent: 5876268 (1999-03-01), Lamphere et al.
patent: 5897426 (1999-04-01), Somekh
patent: 5972792 (1999-10-01), Hudson
patent: 6007407 (1999-12-01), Rutherford et al.
patent: 6083840 (2000-07-01), Mravic
patent: 6099389 (2000-08-01), Nichols et al.
patent: 6435945 (2002-08-01), Somekh
patent: 6582282 (2003-06-01), Somekh
patent: 0 318 135 (1989-05-01), None
patent: 03092264 (1991-04-01), None

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