Method of manufacturing an electronic circuit and...

Radiation imagery chemistry: process – composition – or product th – Electric or magnetic imagery – e.g. – xerography,... – Post imaging process – finishing – or perfecting composition...

Reexamination Certificate

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C427S458000, C205S126000, C118S621000

Reexamination Certificate

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06977130

ABSTRACT:
A method of manufacturing an electronic circuit satisfying demands for cost reduction, diversified small-quantity production, and a shorter cycle of design, manufacture, evaluation, correction, and so on is provided. The method includes at least forming a first pattern or forming a second pattern. Forming the first pattern comprises: forming a visible image on an electrostatic latent image formed on a photosensitive base, by the adhesion of charged particles essentially made of a resin; transferring the visible image onto the intermediate transfer base by the contact and pressurization of the visible image; heating/softening on the intermediate transfer base; and transferring a heated/softened resin layer onto a base material by the contact and pressurization of the resin layer. In forming the second pattern, using charged particles containing conductive metal particulates, a conductor metal layer is formed by electroless plating after a metal-containing resin pattern is transferred similarly to the first pattern formation.

REFERENCES:
patent: 4585319 (1986-04-01), Okamoto et al.
patent: 4588617 (1986-05-01), Oka
patent: 4897326 (1990-01-01), Marengo
patent: 6524758 (2003-02-01), Eberlein et al.
patent: 08-056077 (1996-02-01), None
patent: 2001-284769 (2001-10-01), None
Japanese Patent Office machine assisted English language translation of JP 2001-284769.

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