Method for manufacturing flip-chip semiconductor assembly

Details Method for manufacturing flip-chip semiconductor assembly Method for manufacturing flip-chip semiconductor assembly

2005-12-06

2005-12-06

Nguyen, Tuan H. (Department: 2813)

Semiconductor device manufacturing: process

With measuring or testing

C438S015000, C438S017000, C438S108000

Reexamination Certificate

active

06972200

ABSTRACT:
Flip-chip semiconductor assemblies, each including integrated circuit (IC) dice and an associated substrate, are electrically tested before encapsulation using an in-line or in-situ test socket or probes at a die-attach station. Those assemblies using “wet” quick-cure epoxies for die-attachment may be tested prior to the epoxy being cured by pressing the integrated circuit (IC) dice against interconnection bumps on the substrate for electrical connection, while those assemblies using “dry” epoxies may be cured prior to testing. In either case, any failures in the dice or in the interconnections between the dice and the substrates can be easily fixed, and the need for the use of “known good dice” (KGD) rework procedures during repair is eliminated.

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