Thermal processing method and thermal processing apparatus...

Details Thermal processing method and thermal processing apparatus... Thermal processing method and thermal processing apparatus...

2005-08-30

2005-08-30

Fuqua, Shawntina (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C219S390000, C219S388000, C219S411000, C219S121600, C392S416000, C392S418000, C392S423000, C392S424000, C118S724000, C118S725000, C118S050100, C118S729000

Reexamination Certificate

active

06936797

ABSTRACT:
Each of a plurality of flash lamps forming a light source is a bar lamp having an elongated cylindrical shape. The ratio of the distance between the flash lamps and a semiconductor wafer to the distance between the flash lamps and a reflector is set to not more than 1.8 or at least 2.2. Consequently, illuminance is weakened on portions of the main surface of the semiconductor wafer located immediately under the flash lamps along the vertical direction and strengthened in portions located immediately under the clearances between adjacent ones of the flash lamps along the vertical direction, thereby reducing illuminance irregularity on the overall main surface of the semiconductor wafer and improving in-plane uniformity of temperature distribution on the semiconductor wafer. Thus, a thermal processing apparatus capable of improving in-plane uniformity of temperature distribution on a substrate is provided.

REFERENCES:
patent: 4525380 (1985-06-01), Arai et al.
patent: 4567352 (1986-01-01), Mimura et al.
patent: 4649261 (1987-03-01), Sheets
patent: 6376806 (2002-04-01), Yoo
patent: 6518547 (2003-02-01), Takahashi et al.
patent: 57-162340 (1982-10-01), None
patent: 59-169125 (1984-09-01), None
patent: 60-258928 (1985-12-01), None
patent: 63-166219 (1988-07-01), None
patent: 3281018 (2002-05-01), None

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