Plural semiconductor devices in monolithic flip chip

Details Plural semiconductor devices in monolithic flip chip Plural semiconductor devices in monolithic flip chip

2005-05-17

2005-05-17

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S713000, C257S722000

Reexamination Certificate

active

06894397

ABSTRACT:
A flip chip structure contains laterally spaced semiconductor devices such as MOSFETs in a common chip. A deep trench isolates the devices. Contacts are connected to the source drain and gate electrode (or other electrodes) and are interconnected as required for a circuit function either within the chip or on the support board. Ball contacts are connected to the electrodes. The opposite surface of the chip to that in which the devices are formed receives a copper or other metal layer which is patterned to increase its area for heat exchange. The surface of the copper is coated with black oxide to increase its ability to radiate heat.

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