Manufacture method for semiconductor device with small...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S288000, C257S368000, C257S377000, C257S384000, C257S330000, C257S332000, C257S333000, C257S334000, C257S321000

Reexamination Certificate

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06888183

ABSTRACT:
After a MOS type transistor is formed on the surface of a semiconductor substrate, an interlayer insulating film covering the transistor is formed. The insulating film includes a silicon oxide film made of hydrogen silsesquioxane resin in a ceramic state. After a wiring layer is formed on the insulating film, a silicon oxide film as a surface protection film is formed on the insulating film, covering the wiring layer. In order to reduce process damages, heat treatment is performed 30 minutes at 400° C. in a nitrogen gas atmosphere. With this heat treatment, hydrogen in the silicon oxide film is released and diffuses into the channel region of the transistor to lower interfacial energy levels. Since the silicon nitride film does not transmit hydrogen, it is not necessary for the heat treatment atmosphere to contain hydrogen. A variation in threshold voltages of MOS type transistors can be easily lowered.

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Japanese Office Action issued Jul. 4, 2000.
English-language concise explanationof relevance of the threee Japanese-language documents listed herein.
Technical Report of the Institute of Electronics, Information and Communication Engineers, vol. 97, No. 508, SDM97-181, Jan. 23, 1998, pp. 25-32.

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