Apparatus for determining residual stress, method for...

Measuring and testing – Hardness – By penetrator or indentor

Reexamination Certificate

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Reexamination Certificate

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06851300

ABSTRACT:
Disclosed herein is an apparatus for measuring residual stress, methods of measuring residual stress data and residual stress using the apparatus, and a recording medium for storing software of the residual stress measuring method. The present invention is advantageous for evaluation of a mechanical material property and is non-destructive. Further, the present invention is widely applied to fields ranging from a microscopic area, such as a thin film or micro device, to a large-sized structure, and is not influenced by a microstructure by controlling the range of an applied load. Further, the measuring apparatus of the present invention is minimized in its volume to be easily attached to an actual structure. Further, in the present invention, various attaching devices are employed, thus enabling the apparatus to be attached to various materials regardless of the size and type of object materials to measure residual stress. Further, the measuring apparatus of the present invention is horizontally movable, so there is no need to move an apparatus body itself so as to take measurements at several positions of several materials. Further, the present invention does not require separate measurements for correcting experimental constants at the time of analyzing measured data.

REFERENCES:
patent: 4856326 (1989-08-01), Tsukamoto
patent: 5616857 (1997-04-01), Merck et al.
patent: 6142010 (2000-11-01), Merck et al.
patent: 6247355 (2001-06-01), Suresh et al.
patent: 6247356 (2001-06-01), Merck et al.
patent: 6718820 (2004-04-01), Kwon et al.
A. Bolshakov et al., “Influences of stress on the meansurement of mechanical properties using nanoindentation: Part II. Finite element simulations”, Journal of Materials Research, vol. 11, No. 3, Mar. 1996, pp. 760-768.
C.L. Eriksson et al., “Strain-hardening and residual stress effects in plastic zones around indentations”, Materials Science and Engineering A00 (2002), pp. 1-11.
Yun-Hee Lee et al., “Residual stresses in DLC/Si and Au/SI systems: Application of a stress-relaxation model to the nanoindentation technique”, Journal of Materials Research, vol. 17, No. 4, Apr. 2002, pp. 901-906.
S. Suresh et al., “A new method for estimating residual stresses by instrumented sharp indentation”, Acta mater., vol. 46, No. 16, 1998, pp. 5755-5767.
T.Y. Tsui et al., “Influences of stress on the measurement of mechanical properties using nanoindentation: Part I. Experimental studies in an aluminum alloy”, Journal of Materials Research, vol. 11, No. 3, Mar. 1996, pp. 752-759.
Audrey V. Zagrebelny et al., “Indentation of strained silicate-glass films on alumina substrates”, Scripta Materialia, vol. 37, No. 12, 1997, pp. 1869-1875.

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