Apparatus for forming a stack of packaged memory dice

Details Apparatus for forming a stack of packaged memory dice Apparatus for forming a stack of packaged memory dice

2005-05-24

2005-05-24

Gebremariam, Samuel A. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S685000, C257S784000, C257S723000

Reexamination Certificate

active

06897553

ABSTRACT:
A stacked assembly of integrated circuit semiconductor devices includes a stack of integrated circuit semiconductor devices supported by a printed circuit board (PCB). One or more multiconductor insulating assemblies provide an interface between terminals of the integrated circuit semiconductor devices and external circuitry.

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