Method for producing a substrate arrangement

Details Method for producing a substrate arrangement Method for producing a substrate arrangement

2005-10-18

2005-10-18

Nguyen, Ha Tran (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S118000, C438S612000, C438S615000

Reexamination Certificate

active

06955943

ABSTRACT:
A method is provided for producing a substrate arrangement. The process includes the preparation of a substrate and bringing connecting surfaces of the substrate into contact with inner contacts of a wiring layer, the application of contact material to outer contacts of the wiring layer defining an outer connecting surface arrangement to form base contact bumps (31) and the application of joining material to the base contact bumps to form contact bump tops joined to the base contact bumps, wherein the joining material is applied as joining material moldings (35) and the contact bump tops are formed by at least partial melting of the joining material moldings by the action of laser energy.

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IBM Aug. 1988 Novel Laser Soldering Process for Flex Circuit Attachment IBM Technical Disclosure Bulletin, vol. 31, No. 3.

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