Etching a substrate: processes – Gas phase etching of substrate
Reexamination Certificate
2005-05-03
2005-05-03
Norton, Nadine G. (Department: 1765)
Etching a substrate: processes
Gas phase etching of substrate
C216S060000, C216S067000, C216S074000, C216S079000
Reexamination Certificate
active
06887396
ABSTRACT:
A method is provided for making a micromirror unit which includes a frame, a mirror forming base, and bridges connecting the frame to the mirror forming base. The method includes the following steps. First, a first mask pattern is formed on a substrate for masking portions of the substrate which are processed into the frame and the mirror forming base. Then, a second mask pattern is formed on the substrate for masking portions of the substrate which are processed into the bridges. Then, the substrate is subjected to a first etching process with the first and the second mask patterns present as masking means. Then, the second mask pattern is removed selectively. Then, the substrate is subjected to a second etching process with the first mask pattern present as masking means. Finally, the first mask pattern is removed.
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Mizuno Yoshihiro
Sawaki Ippei
Tsuboi Osamu
Ueda Satoshi
Yamagishi Fumio
Armstrong Kratz Quintos Hanson & Brooks, LLP
Fijitsu Limited
Fujitsu Media Devices Limited
Norton Nadine G.
Tran Binh X.
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