Process for manufacturing flexible wiring boards

Details Process for manufacturing flexible wiring boards Process for manufacturing flexible wiring boards

2005-02-01

2005-02-01

Chang, Richard (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S842000, C029S830000, C174S267000, C361S760000, C361S774000, C257S737000, C257S782000

Reexamination Certificate

active

06848176

ABSTRACT:
A process for manufacturing a flexible wiring board according to the present invention comprises growing metal bumps16using a mask film patterned by photolithography. Fine openings can be formed with good precision, therefore, fine metal bumps16can be formed with good precision because laser beam is not used to form openings in a polyimide film. After metal bumps16have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to expose the tops of metal bumps16.

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