Semiconductor device provided with rewiring layer

Details Semiconductor device provided with rewiring layer Semiconductor device provided with rewiring layer

2005-08-09

2005-08-09

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257S690000, C257S738000

Reexamination Certificate

active

06927489

ABSTRACT:
In a small semiconductor device having external terminals on a semiconductor element and a semiconductor module mounted with the small semiconductor device, disconnection of the external terminals is prevented when a temperature change occurs under the conditions that the semiconductor device is mounted on a printed circuit board. To achieve this a projection is formed on a land which is an external terminal bonding area of the semiconductor device, and a protruded portion of the projection is bonded to the external terminal. An intervening portion of a protective film made of resin material is formed between the lands and semiconductor element.

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Nikkei Micro Devices, Apr. 1998 (pp. 164-167)—Disclosed in specification—Translation not available.

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