Semiconductor device with improved heatsink structure

Details Semiconductor device with improved heatsink structure Semiconductor device with improved heatsink structure

2005-08-23

2005-08-23

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S668000

Reexamination Certificate

active

06933612

ABSTRACT:
A semiconductor device for an improved heatsink structure. The semiconductor device is composed of a first substrate, a first heatsink plate connected to the first substrate, a second substrate having a rear surfaces connected to the first heatsink plate, a semiconductor chip having a main surface bonded to a main surface of the second substrate, and a second heatsink plate connected to a rear surface of the semiconductor chip.

REFERENCES:
patent: 5739581 (1998-04-01), Chillara et al.
patent: 6201701 (2001-03-01), Linden et al.
patent: 6452113 (2002-09-01), Dibene et al.
patent: 07-029940 (1995-01-01), None
patent: 08-064730 (1996-03-01), None
patent: 2000-174180 (2000-06-01), None
patent: 2002-164485 (2002-06-01), None

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