Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2005-02-08
2005-02-08
Lam, Cathy F. (Department: 1775)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S774000, C257S779000
Reexamination Certificate
active
06853091
ABSTRACT:
A printed circuit board having circuit patterns printed thereon has a plurality of composite lands each including a first land having a terminal hole formed at its center for inserting the terminal of a selected electric or electronic part or device, and a plurality of second lands each being contiguous to and extending outwards from the first land. The areas contiguous to the contours of the first and second lands have no conductive foils, such as copper foils, thereon such that the substrate surface of the printed circuit board is exposed in these areas. The exposed areas are effective to confine the thermal energy in the limited areas for soldering. And the composite land shape defines a ridged cone-like solder lump, which can fixedly grip the terminal of the part or device.
REFERENCES:
patent: 3610811 (1971-10-01), O'Keefe
patent: 6174562 (2001-01-01), Bergstedt
patent: 6201305 (2001-03-01), Darveaux et al.
patent: 20020086144 (2002-07-01), Honda et al.
patent: 6-164119 (1994-06-01), None
patent: 8-340172 (1996-12-01), None
patent: 2000-091737 (2000-03-01), None
Lam Cathy F.
Orion Electric Co. Ltd.
Wenderoth , Lind & Ponack, L.L.P.
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