Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-03-01
2005-03-01
Parekh, Nitin (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S107000, C438S108000, C438S122000, C438S125000, C438S617000, C257S686000, C257S723000, C257S784000
Reexamination Certificate
active
06861288
ABSTRACT:
A method for fabricating a stacked semiconductor package includes providing a substrate and mounting a first semiconductor device on the substrate. An interposer is supported above the first semiconductor device opposite the substrate. The interposer is electrically connected to the substrate. A second semiconductor device is then mounted on the interposer.
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Eurasem B.V., “moulded cavity package”, Data Sheet, 2 pages, Nijmegen, The Netherlands.
Chow Seng Guan
Han Byung Joon
Ramakrishna Kambhampati
Shim Il Kwon
Ishimaru Mikio
Parekh Nitin
ST Assembly Test Services Ltd.
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