Semiconductor device having polycrystalline silicon load devices

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257380, 257536, 257538, H01L 2362

Patent

active

056024088

ABSTRACT:
A semiconductor device comprises a silicon semiconductor substrate and an insulating film formed on a surface of the silicon semiconductor substrate. One of a surface of the silicon semiconductor substrate or a surface of the insulating film is provided with at least one step portion. A polycrystalline silicon layer is formed uniformly on at least a side surface of the step portion and a top surface of the insulating film. The polycrystalline silicon layer which is formed on the side surface of the step portion comprises a resistance element, and a portion of the polycrystalline silicon layer which is formed on the top surface of the insulating film is doped with an impurity to form a conductive element. By this construction, the area occupied by the load devices on the semiconductor substrate is effectively reduced, thereby increasing the packing density of the semiconductor device.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device having polycrystalline silicon load devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having polycrystalline silicon load devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having polycrystalline silicon load devices will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-344407

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.