Method for evaluating pattern defects on a water surface

Details Method for evaluating pattern defects on a water surface Method for evaluating pattern defects on a water surface

2005-09-06

2005-09-06

Mehta, Bhavesh M. (Department: 2625)

Image analysis

Applications

Manufacturing or product inspection

C382S145000, C382S218000, C382S305000, C356S237100, C356S394000, C250S559040, C348S126000, C348S129000

Reexamination Certificate

active

06941009

ABSTRACT:
The invention concerns a method for evaluating pattern defects on a wafer surface, comprising the following steps: acquiring the surface data of a plurality of individual image fields (4) of a series-produced wafer (1); storing the data in a reference data set and making it available as reference data for the inspection of further wafers of the same series; inspecting, successively in time, the individual image fields (4) on the surface of a wafer (1) presently being examined; retrieving from the reference data set a reference datum corresponding to the respective individual image field (4) presently being inspected; comparing the surface of each individual image field (4) currently being inspected to the corresponding reference datum; if one or more deviations are identified, subsequently classifying the deviations into critical and noncritical defects in terms of the functionality of the chip; and simultaneously updating or adding to the reference data set.

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