Electrochemical assisted CMP

Details Electrochemical assisted CMP Electrochemical assisted CMP

2005-04-05

2005-04-05

Valentine, Donald R. (Department: 1742)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S239000, C204S22400M

Reexamination Certificate

active

06875322

ABSTRACT:
A method for material removal and planarization of a substrate includes formation of a weak passivating film on overburden to be removed in the presence of an electrolyte bath and an applied electric potential. An engineered polishing substrate is brought into compliance with the weak passivating film, and using low pressure to minimize shear stress realized at the surface of the substrate, material removal is controlled by mechanical contact between the polishing substrate and the weak passivating film. The weak passivating film is periodically reformed, and mechanical contact continued until desired material removal and substrate planarization is achieved.

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