Method of fabricating devices incorporating...

Details Method of fabricating devices incorporating... Method of fabricating devices incorporating...

2005-01-25

2005-01-25

Zarabian, Amir (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S050000, C438S106000, C438S110000, C438S113000, C438S458000, C438S459000, C438S460000, C438S464000, C438S977000

Reexamination Certificate

active

06846692

ABSTRACT:
A method of fabricating devices incorporating microelectromechanical systems (MEMS) using UV curable tapes includes providing a silicon substrate12with a MEMS layer14arranged on one side of the substrate12. A first UV curable tape22is applied to the MEMS layer14. At least one operation is performed on the substrate14via an opposed side of the substrate14. A second UV curable tape32is applied to the opposed side of the substrate14and the first tape22is removed by exposing it to UV light. At least one operation is performed on the MEMS layer to form individual MEMS chips which are able to be removed individually from the second UV tape32by localised exposure of the tape32to UV light.

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