Abrading – Abrading process
Reexamination Certificate
2005-05-17
2005-05-17
Wilson, Lee D. (Department: 3723)
Abrading
Abrading process
C451S527000, C451S530000, C156S922000, C051S295000
Reexamination Certificate
active
06893325
ABSTRACT:
Method and apparatus for increasing chemical-mechanical-polishing (CMP) selectivity is described. A CMP pad is formed having a pattern of recesses and islands to provide non-contact portions and contact portions, respectively, with respect to contacting a substrate assembly surface to be polished. As the CMP pad is formed from a non-porous material, chemical and mechanical components of material removal are parsed to the non-contact portions and the contact portions, respectively. The relationship or spacing from one contact island to another, or, alternatively viewed, from one non-contact recess to another, provides a duty cycle, which is tailored to increase selectivity for removal of one or more materials over removal of one or more other materials during CMP of a substrate assembly.
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Micro)n Technology, Inc.
Ojini Anthony
Schwegman Lundberg Woessner & Kluth P.A.
Wilson Lee D.
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