Semiconductor processing equipment having improved process...

Details Semiconductor processing equipment having improved process... Semiconductor processing equipment having improved process...

2005-04-19

2005-04-19

Zarabian, Amir (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S115000, C438S706000, C438S707000, C438S710000, C438S719000

Reexamination Certificate

active

06881608

ABSTRACT:
A plasma processing chamber including a slip cast part having a surface thereof exposed to the interior space of the chamber. The slip cast part includes free silicon contained therein and a protective layer on the surface which protects the silicon from being attacked by plasma in the interior space of the chamber. The slip cast part can be made of slip cast silicon carbide coated with CVD silicon carbide. The slip cast part can comprise one or more parts of the chamber such as a wafer passage insert, a monolithic or tiled liner, a plasma screen, a showerhead, dielectric member, or the like. The slip cast part reduces particle contamination and reduces process drift in plasma processes such as plasma etching of dielectric materials such as silicon oxide.

REFERENCES:
patent: 3951587 (1976-04-01), Alliegro et al.
patent: 3962391 (1976-06-01), Dietze et al.
patent: 4093201 (1978-06-01), Dietze et al.
patent: 4203940 (1980-05-01), Dietze et al.
patent: 4340462 (1982-07-01), Koch
patent: 4401689 (1983-08-01), Ban
patent: 4491496 (1985-01-01), Laporte et al.
patent: 4518349 (1985-05-01), Tressler et al.
patent: 4761134 (1988-08-01), Foster
patent: 4869929 (1989-09-01), Cabrera et al.
patent: 4948458 (1990-08-01), Ogle
patent: 4978567 (1990-12-01), Miller
patent: 4987016 (1991-01-01), Ohto et al.
patent: 4999228 (1991-03-01), Matsumoto et al.
patent: 5006220 (1991-04-01), Hijikata et al.
patent: 5022979 (1991-06-01), Hijikata et al.
patent: 5074456 (1991-12-01), Degner et al.
patent: 5085727 (1992-02-01), Steger
patent: 5182059 (1993-01-01), Kawasaki et al.
patent: 5200232 (1993-04-01), Tappan et al.
patent: 5252892 (1993-10-01), Koshiishi et al.
patent: 5262029 (1993-11-01), Erskine et al.
patent: 5283089 (1994-02-01), Bates
patent: 5292399 (1994-03-01), Lee et al.
patent: 5366585 (1994-11-01), Robertson et al.
patent: 5460684 (1995-10-01), Saeki et al.
patent: 5463525 (1995-10-01), Barnes et al.
patent: 5494523 (1996-02-01), Steger et al.
patent: 5538230 (1996-07-01), Sibley
patent: 5556501 (1996-09-01), Collins et al.
patent: 5569356 (1996-10-01), Lenz et al.
patent: 5578129 (1996-11-01), Moriya
patent: 5595627 (1997-01-01), Inazawa et al.
patent: 5641375 (1997-06-01), Nitescu et al.
patent: 5680013 (1997-10-01), Dornfest et al.
patent: 5788799 (1998-08-01), Steger et al.
patent: 5792304 (1998-08-01), Tamura et al.
patent: 5798016 (1998-08-01), Oehrlein et al.
patent: 5820723 (1998-10-01), Benjamin et al.
patent: 5838529 (1998-11-01), Shufflebotham et al.
patent: 5863376 (1999-01-01), Wicker et al.
patent: 5885356 (1999-03-01), Zhao et al.
patent: 5888907 (1999-03-01), Tomoyasu et al.
patent: 5892236 (1999-04-01), Takahashi et al.
patent: 5904778 (1999-05-01), Lu et al.
patent: 6048798 (2000-04-01), Gadgil et al.
patent: 6073577 (2000-06-01), Lilleland et al.
patent: 6129808 (2000-10-01), Wicker et al.
patent: 6227140 (2001-05-01), Kennedy et al.
patent: 6251793 (2001-06-01), Wicker et al.
patent: 6358565 (2002-03-01), Krenkel et al.
patent: 6583064 (2003-06-01), Wicker et al.
patent: 0284885 (1988-10-01), None
patent: 0693865 (1996-01-01), None
patent: 0 821397 (1998-01-01), None
patent: 0 826646 (1998-03-01), None
patent: 60-200519 (1985-10-01), None
patent: 63-35452 (1988-02-01), None
patent: 63-138737 (1988-08-01), None
patent: 63-186874 (1988-08-01), None
patent: 3-201322 (1991-09-01), None
patent: 5-090184 (1993-09-01), None
patent: 8-17745 (1996-01-01), None
patent: 63-273323 (1998-11-01), None
patent: 9950886 (1999-10-01), None

Affiliated with

Also associated with

Rating

Semiconductor processing equipment having improved process... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor processing equipment having improved process..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor processing equipment having improved process... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3433504