Electronic component with a semiconductor chip, method of...

Details Electronic component with a semiconductor chip, method of... Electronic component with a semiconductor chip, method of...

2005-03-29

2005-03-29

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S678000, C257S792000, C257S793000, C257S794000

Reexamination Certificate

active

06873060

ABSTRACT:
The electronic component has a semiconductor chip embedded in a plastic compound. The electronic component is produced by first producing a number of electronic components on a panel and subsequent dicing into single electronic components. The semiconductor chip of this component is disposed on a substrate the includes or is entirely formed of plastic and it is embedded in a plastic package molding compound. The plastic of the substrate has a glass transition temperature range which is lower than the glass transition temperature range of the plastic package molding compound.

REFERENCES:
patent: 4763409 (1988-08-01), Takekawa et al.
patent: 5666008 (1997-09-01), Tomita et al.
patent: 5855821 (1999-01-01), Chau et al.
patent: 5894984 (1999-04-01), Sakai et al.
patent: 6309916 (2001-10-01), Crowley et al.
patent: 9918609 (1999-04-01), None

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