Method for making multilayer thin-film electronics

Details Method for making multilayer thin-film electronics Method for making multilayer thin-film electronics

2005-05-17

2005-05-17

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S109000, C438S119000, C438S128000, C438S455000, C438S610000

Reexamination Certificate

active

06893896

ABSTRACT:
Multilayer thin-film electronics are manufactured at high speed, even while the various component functions are manufactured separately under conditions tailored to optimize component performance and yield. Each function or group of functions is fabricated on a separate flexible substrate. These flexible substrates are bonded to each other using adhesive films that are anisotropic electrical conductors or optical light guides. The bonding is performed by laminating the flexible substrates to each other in a continuous process, using the anisotropic conductor as the bonding layer.

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