Solder ball fabricating process

Details Solder ball fabricating process Solder ball fabricating process

2005-03-01

2005-03-01

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S614000, C228S180220

Reexamination Certificate

active

06861346

ABSTRACT:
A solder ball fabricating process for forming solder balls over a wafer having an active layer is provided. A patterned solder mask layer is formed over the active surface of the wafer. The patterned solder mask layer has an opening that exposes a bonding pad on the wafer. Solder material is deposited into the opening over the bonding pad. A reflow process is conducted to form a pre-solder body. The aforementioned steps are repeated so that various solder materials are fused together to form a solder ball over the bonding pad.

REFERENCES:
patent: 6673711 (2004-01-01), Tong et al.

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