Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2005-07-26
2005-07-26
Thornton, Yvette C. (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S286100, C430S905000, C526S281000, C526S256000, C568S018000
Reexamination Certificate
active
06921622
ABSTRACT:
Photoresist monomers of following Formula 1, photoresist polymers thereof, and photoresist compositions containing the same. The photoresist polymer includes a repeating unit comprising the photoresist monomer of Formula 1 as a comonomer and the photoresist composition containing the same have excellent etching resistance, heat resistance and adhesiveness to a wafer, and is developable in aqueous tetramethylammonium hydroxide (TMAH) solution. In addition, the photoresist composition has low light absorbance at 157 nm wavelength, and thus is suitable for a photolithography process using ultraviolet light sources such as VUV (157 nm) in fabricating a minute circuit for a high integration semiconductor device
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Sigma-Aldrich Product No. B8,450-5 Butadiene Sulfone; www.sigmaaldrich.com.
“Polymerization of Butadiene Sulfone” Minoura et al. Journal of Polymer Science Part A-1: Polymer Chemistry; vol. 4, Issue 12, pp. 2929-2944 Dec. 1966.
Jung Jae Chang
Lee Geun Su
Shin Ki Soo
Hynix / Semiconductor Inc.
Marshall & Gerstein & Borun LLP
Thornton Yvette C.
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