Method of partially plating substrate for electronic devices

Details Method of partially plating substrate for electronic devices Method of partially plating substrate for electronic devices

2005-04-26

2005-04-26

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C029S839000, C029S840000

Reexamination Certificate

active

06884708

ABSTRACT:
The object of the present invention is to provide a free and precise control of the plating amount while easily determining a selected portion to be plated.Small balls24are arranged at, and adhered or bonded to, via holes22of a TAB tape21and the small balls24are then melted so that a copper wiring23exposed at the via holes22of the TAB tape21can be selectively plated with a different metal to enable selected portions of a substrate for electronic devices to be partially plated easily and precisely.

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