Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-05-17
2005-05-17
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S612000, C438S613000, C438S614000
Reexamination Certificate
active
06893952
ABSTRACT:
A ball grid array for a flip-chip assembly is disclosed. The ball grid array includes a plurality of bumps bonded between an active surface of a semiconductor die and a top surface of a printed circuit board or any type of substrate carrier. The plurality of balls include at least one bump having a core material and an outer layer. The rigidity of the core material is greater than that of the material of the outer layer. Additionally, the melting temperature of the core material is higher than the material of the outer layer. By this arrangement, the core material with an outer layer provides bumps that are substantially uniform in height. In addition, the balls only procure marks or deformation to the core material during burn-in testing and reflow. Therefore, when bonding the semiconductor device to the substrate, the ball grid array provides sufficient electrical and mechanical connection despite any non-planarity in the active surface of the semiconductor device and the top surface of the substrate, and any differing height in the plurality of balls due to testing the semiconductor device.
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Akram Salman
Jiang Tongbi
Brewster William M.
Coleman W. David
Micro)n Technology, Inc.
TraskBritt
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